The High Accelerated Stress Test Chamber (HAST) is designed for the semiconductor chip industry, as well as for applications in civil aviation, commercial aerospace, shipping, automotive, new energy, scientific research institutions, and universities. It is used to test electronic parts, components, integrated circuits, materials, and processes by accelerating high-temperature, high-humidity, high-pressure cycling and constant stress tests, in order to determine whether functional failures occur due to durability (service life) or environmental changes.
| Prooduct Name |
Highly Accelerated Stress Test Chamber(HAST Chamber) |
| Prooduct Model |
HPSC251-M |
HPSC252-M |
| Working chamber volume |
51L |
51L×2 tanks |
| Working chamber dimensions |
φ380×D450(R×D) |
φ380×D450(R×D)×2 tanks |
| Tank Size |
φ450×D600(R×D) |
φ450×D600(R×D)×2 tanks |
| External dimensions |
1200×1960×1140mm(W×H×D) |
1200×2170×1140mm(W×H×D) |
| Temperature range |
105℃~150℃ |
| Temperature fluctuation |
≤±0.5℃ |
| Temperature uniformity |
≤2℃ |
| Temperature deviation |
±2℃ |
| Pressure Range |
110kPa~300kPa(Absolute Pressure) |